Higher heat resistance 6051 insulation polyimide film
6051 polyimide film is synthesized by polymerizing PMDA and ODA in strong polar solvents through the process of forming film and imines treatment at high temperature.
Features and Applications:
class H insulation
Excellent physical, chemical and electrical properties
Atomic radiation resistant, solvent resistant
low & high temperature resistant (as low as -452F(-269°C) and as high as +500F(+260°C).
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Technology Data of 6051 polyimide film
NO
|
Index Description
|
unit
|
index value
|
1
|
Density
|
g/cm3
|
1.38~1.43
|
2
|
Contraction rate,longitudinal and horizontal 150°c-400°c
|
%
|
<1.0
<3.0
|
3
|
Surface resistively,200°c
|
Ω
|
>1.0*1013
|
4
|
volume resistively,200°c
|
Ω.m
|
>1.0*1010
|
5
|
Relative Dielectric factor constant 48-62HZ
|
-
|
3.5±0.4
|
6
|
Media Loss Factor 48-60HZ
|
-
|
<4.0*10-3
|
7
|
Long-term Thermal Resistant
|
-
|
<4.0*10-3
|
8
|
Temprature Index
|
-
|
>180
|
Available: In rolls
6051 insulation polyimide film
Usage:
Widely used in electronic& electrical industry as for FPC, mobile, computer,motor,transformer etc. also widely used in aerospace industry,transportation, atomic energy industry etc.
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Miss Lea